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Semiconductors

Semiconductors

Ångström Precision

The semiconductor industry plays a critical role in powering modern technology and driving innovation on a global level. Strict requirements for manufacturing and processing of semiconductors demand utmost precision and quality. Meister Abrasives provides fixed abrasive grinding solutions for different steps of the semiconductor manufacturing chain from the bare crystal to the finished microchips.

Precision Grinding of Semiconductors

Precision Grinding of Semiconductors

Hybrid and vitrified bond grinding tools represent a quantum leap in quality and reliability in semiconductor processing. Meister Abrasives’ diamond grinding tools target boule, puck, seed, and wafer grinding. With a best-in-class total topography (Sa, Sz, Bow, Warp, TTV), surface qualities in the one-digit Angstrom range are achieved. The specially developed grinding tools of Meister Abrasives are used for processing a wide range of materials such as silicon carbide (SiC), silicon (Si), polysilicon (poly-Si), sapphire (Al2O3), gallium nitride (GaN), indium phosphide (InP), gallium arsenide (GaAS), lithium niobate (LiNbO3), lithium tantalum (LiTa), and extremely hard ceramics.

Meister Abrasives’ innovative grinding wheel technologies allow prime wafer and device manufacturers to shorten wafer preparation steps to the minimum. For example, the ultra-smooth surface profile achieved by the UF6 DIA technology enables manufacturers to avoid diamond slurry costs, reduce chemical mechanical polishing (CMP) cost tremendously and drastically increase throughput.

Meister Abrasives

Our semiconductors expertise at a glance

Prime wafer and seed crystal substrate production

Grinding applications in the wafer-substrate production chain for materials, such as Si, SiC, sapphire, GaN, InP, GaAS, LiNb, LiTa, among others, including boule/ingot and edge grinding

Special wafer processing

Backgrinding and wafer thinning e.g. for SiC, MEMS, SOI, 3D-TSV, ultra-thin wafers, reclaim, eWlp or DBG grinding including special edge grindings

Power electronics and LEDs

Grinding processing in the value chain of LED’s and power device manufacturing for new e-Mobility applications based on SiC / GaN or Sapphire substrates

5G Technologies

Grinding processing for modern 5G Technologies used for SAW/BAW frequency filter devices based on LiTa-, LiNb- or Si-Wafer

Technology: the perfect match between bond and grit

Technology: the perfect match between bond and grit

At the heart of Meister Abrasives’ cutting-edge grinding solutions is the brand’s proprietary bond-grit formulation. The unique bond-grit recipe allows for modifications not only of the grit but of the whole formula. Customizing the nanostructure allows Meister Abrasives to adapt to each surface condition: whether the start surface is sawn, lasered, lapped or polished, Meister Abrasives has the right tools. The brand’s expertise in varying the properties of the abrasive, the type of the bond and the engineering of the wheels, allows it to make grinding wheels that suit any individual use.

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